Easy World Automation | Nexcom VTC 1030 In-Vehicle Computer

Nexcom VTC 1030 In-Vehicle Computer

  • Intel Atom® x6211E dual-core processor, 6W
  • Compact and fanless design
  • 5G NR and Wi-Fi 6/6E wireless communication options
  • Built-in GNSS receiver with optional dead reckoning function
  • Built-in 1 x CAN bus 2.0B (optional SAE J1939)
  • Wide range DC input from 9~36V
  • Smart power management with Ignition on/off delay via software control and low voltage protection
  • Dual display outputs and 2.5GbE LAN ports
  • 1 x mini-PCIe + 2 x M.2 socket expansion
  • Certified by CE/FCC/E13 mark

Description

VTC 1030, a compact and rugged entry-level vehicle computer with Intel Atom® x6211E dual-core processor 1.3GHz/3GHz (burst), designed for the harsh in-vehicle environment. Due to the compact design, it is especially for vehicles with limited space.

VTC 1030 has onboard CAN 2.0B for vehicle diagnostics and driver behavior management. Its advanced GNSS receiver supports GPS/Glonass/QZSS/Galileo/Beidou while offering an optional dead reckoning module. Moreover, VTC 1030 features optional WLAN Wi-Fi 6/6E/Wi-Fi 5 and WWAN 5G NR/LTE wireless data connectivity. With an external micro-SIM socket, it allow users to access micro-SIM card conveniently. Its 12VDC output can be provided for an external display with easy power wire arrangement. VTC 1030 maintains the flexibility to meet different demands for telematics applications, such as wireless gateway, infotainment, fleet management, and patching system.


You can place an order for the Nexcom VTC 1030 In-Vehicle Computer, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.

Specification

Interface
LAN 2-port LAN RJ45, 10/100/1000/2500 Mbps Ethernet, Intel® I225-IT
General
CPU Intel Atom® x6211E dual-core processor, 1.3GHz/3GHz (burst), TDP 6W
Memory 1 x 260-pin DDR4 SO-DIMM socket support 3200MHz up to 32GB. Default 2666MHz, 4GB With In-Band ECC (IBECC)
Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0) 1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2) 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 2) for LTE/5G NR module with 2 x external micro-SIM
GNSS Function 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS/Glonass/Galileo/Beidou Optional M8U modules with dead reckoning available 1 x 3D accelerometer and 3D gyroscope
Storage 1 x 2.5” SATA 3.0 internal drive bay (9.5mm) 1 x mSATA slot (occupied mini-PCIe slot)
Computer
Video Output 1 x HDMI 1.4b up to 3840 x 2160@30Hz 1 x VGA port 1920 x 1200@60Hz
Interface
I/O Interface-Front 6 x LED indicators (including 1 x programmable LED) 1 x USB 3.2 Gen 2 type A (5V/0.9A) 1 x USB 2.0 type A (5V/0.5A) 2 x Externally accessible micro-SIM card sockets with cover 1 x Reset button 1 x Power button 1 x DB9 (COM1) for full RS232/422/485 1 x Mic-in, 1 x Line-out 2 x LAN RJ45, 10/100/1000/2500 Mbps 2 x RP-SMA connector holes for WLAN 1 x SMA connector for GNSS
I/O Interface-Rear 1 x HDMI 1 x VGA 1 x DB9 (COM2) for full RS232/422/485 1 x DB15 (CAN/DIO) - 1 x Isolated CANBus 2.0B - 5 x DI and 4 x DO - Power in for DIO isolation, 9~36VDC 1 x 3-pin terminal block for 9V~36VDC 1 x Connector (4 x 2) for 12VDC/2A output, reset, power button, RS232 (Tx/Rx) 4 x SMA connector holes for WWAN
Power Requirement
Power Management Power input 9~36VDC Cranking voltage: 6V~9V (< 30 seconds) Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code
Physical Characteristics
Dimensions 185mm (W) x 120mm (D) x 45mm (H)
Operating temperatures -40°C to 70°C (w/ 6W TDP CPU, industrial SSD) with air flow
Storage temperatures -40°C to 85°C
Humidity 90% (non-condensing)
Vibration 2g@5~500 Hz (in operation, SSD) Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test
Shock Protection Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g
Weight 1.20kg
Standards/Certifications CE FCC Class A E13 mark
Compatible Operating Systems
Operating System Windows 11/Windows 10/Linux
General
Security TPM 2.0: infineon SLB9670VQ2.0 FW7.62