Easy World Automation | Nexcom nROK 7271-WI-H Fanless Rolling Stock Computer

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Nexcom nROK 7271-WI-H Fanless Rolling Stock Computer

  • System bare-bone. Intel® 12/13th Gen CPU with DDR5
  • DC input 24~110VDC (w/ isolation)
  • 2 x LAN M12 X-coded
  • 2 x CAN FD
  • Additional 1 x Full-size mini-PCIe socket and 2 x M.2 3042/3050/3052 Key B socket
  • Fanless, compact, and rugged design
  • EN 50155, class OT3 conformity
  • Wide voltage input 24~110VDC (w/ isolation)
  • Optional up to 3-sec protection against temporary voltage dips

Description

NEXCOM system nROK 7271 accomplishes operational efficiency of public transportation and service. Based on Intel® 12/13th Gen FCLGA1700 socket-type CPU and 4/12-port 802.3 af/at PoE, it provides an integral solution incorporating high computing power. With dual SIM cards per modem support, it allows two SIM card backups for better connectivity quality by software. RAID 0, 1 guarantees the safety of data in the 2 x external SSD. The nROK 7271 further distinguishes itself by providing power isolation for 24~110VDC and optional up to 3-sec protection against temporary voltage dips, a feature critical for scenarios where input voltage variability may shut down the equipment. With daughter board expansion design, optional for additional 1 x mini-PCIe slot (BOM optional for M.2 Key E) and 2 x M.2 Key B slot, 8-port 1Gbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W, or 2-port 10GbE M12 X-coded, nROK 7271 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, transportation cellular routers, video servers, and video surveillance.

nROK 7271-WI-HnROK 7271-WI Fanless Rolling Stock Computer, which is applicable in the Railway Transportation, Road Transportation, IP Surveillance industries, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.

Specification

Interface
I/O Interface-Front 4 x LED indicators (storage/WWAN/WLAN/programmable), 1 x HDMI 2.0a/b 2 x USB 3.2 Gen 2 type A (5V/0.9A), 2 x Externally accessible dual nano-SIM card sockets with cover, 1 x microSD card slot with cover, 2 x 2.5” removable SSD tray, 1 x Reset button, 1 x Power button, 2 x M12 X-coded LAN port, 1 x Fan power connector, 1 x SMA connector for GNSS, 4 x SMA connector holes for WWAN, 2 x Externally accessible dual nano-SIM card sockets with cover, 8 x SMA connector holes for WWAN, and 2 x RP-SMA connector holes for WLAN
LAN 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (support WOL)
I/O Interface-Rear 1 x VGA, 1 x M12 A-coded 8-pin for 2 x USB 2.0, 1 x M8 (AUDIO) for 1 x Mic-in, 1 x Line-out, 2 x DB9 (COM1/2) for full RS232/422/485 (isolation), 1 x DB15 (CAN/DIO), 2 x Isolated CAN FD, compatible with CAN2.0A/2.0B, 4 x DI and 4 x DO (isolation), power in source for DIO isolation, 14~48VDC, 1 x M12 K-coded 5-pin for power input, 1 x Connector 2-pin for ignition input, 4 x SMA connector holes for WWAN, 2 x RP-SMA connector holes for WLAN
PoE -
Computer
CPU Intel® 12/13th Gen Core™ CPU (65W/35W), Chipset: Intel R680E, Graphics: Intel® UHDGraphics770,1.55GHz
Expansion 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0), 2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 2, SATA 3.0) for LTE/5G NR module with 1 x external dual nano-SIMs, 1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0, PCIe 3.0), 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0), 2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 1) for LTE/5G NR module with 2 x external dual nano-SIMs
Storage 2 x 2.5” SATA 3.0 external SSD (15mm height, removable), 1 x mSATA (occupied mini-PCIe slot), 2 x M.2 Key B (occupied M.2 socket), 1 x microSD card slot, SDXC v3.01
Video Output 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz, 1 x VGA, up to 1920 x 1200@60Hz
Compatible Operating Systems
Operating System Windows 11/Windows 10/Linux
General
Memory 2 x 262-pin SO-DIMM, DDR5 4800MHz, 64GB in max., ECC & dual-channel support
Security TPM 2.0: InfineonSLB9665TT2.0FW5.62
GNSS 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS /Glonass/Galileo/Beidou, 1 x 3D accelerometer and 3D gyroscope
Physical Characteristics
Dimensions 260 x 210 x 110 (W x D x H) (mm)
Operating temperature EN 50155, class OT3 (-35°C ~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 60W PoE, 8GB memory, industrial SSD) with air flow
Storage Temperature -40°C to 80°C
Relative humidity 90% (non-condensing)
Shock Protection Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g, Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g
Vibration Protection Vibration (random) 2g@5~500 Hz (in operation, SSD), Vibration (SSD) Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure, Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test
Standards and Certifications CE/UKCA/FCC Class A, EN 50155: 2017, Ambient temperature EN 50155, Class OT3 (-35°C ~70°C), 85°C for 10 minutes, Interruptions of voltage supply class S1, Supply change over class C1, EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019, Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30, Shock and vibration IEC 61373 Class B, Protective coating class PC1 (PC2, by request), EN 45545-2: 2020 (PCB)
Weight 7.2kg (TBD)

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