Nexcom nROK 7270-A-H Fanless Rolling Stock Computer
- System bare-bone. Intel® 12/13th Gen CPU with DDR5
- DC input 24/36V (w/o isolation)
- 2 x LAN M12 X-coded
- 2 x CAN FD
Additional 1 x Full-size mini-PCIe socket and 2 x M.2 3042/3050/3052 Key B socket
- Fanless, compact, and rugged design
- Military standard for anti-vibration/shock
- EN 50155, class OT3 conformity
Description
NEXCOM system nROK 7270 accomplishes operational efficiency of public transportation and service. Based on Intel® 12/13th Gen FCLGA1700 socket-type CPU and 4/12-port 802.3 af/at PoE, it provides an integral solution incorporating high computing power. With dual SIM cards per modem support, it allows two SIM card backups for better connectivity quality by software. RAID 0, 1 guarantees the safety of data in the 2 x external SSD. With daughter board expansion design, optional for additional 1 x mini-PCIe slot (BOM optional for M.2 Key E) and 2 x M.2 Key B slot, 8-port 1Gbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W, or 2-port 10GbE M12 X-coded, nROK 7270 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, transportation cellular routers, video servers, and video surveillance.
You can place an order for the Nexcom nROK 7270-A-H Fanless Rolling Stock Computer, which is applicable in the Railway Transportation, Road Transportation, IP Surveillance industries, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.
Specification
| Interface | |
|---|---|
| I/O Interface-Front | 4 x LED indicators (storage/WWAN/WLAN/programmable), 1 x HDMI 2.0a/b, 2 x USB 3.2 Gen 2 type A (5V/0.9A), 2 x Externally accessible dual nano-SIM card sockets with cover, 1 x microSD card slot with cover, 2 x 2.5” removable SSD tray, 1 x Reset button, 1 x Power button, 2 x M12 X-coded LAN port |
| LAN | 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (support WOL) |
| I/O Interface-Rear | 1 x VGA, 1 x M12 A-coded 8-pin for 2 x USB 2.0, 1 x M8 (Audio) for 1 x Mic-in, 1 x Line-out, 2 x DB9 (COM1/2) for full RS232/422/485 (isolation), 1 x DB15 (CAN/DIO), 2 x Isolated CAN FD, compatible with CAN2.0A/2.0B, 4 x DI and 4 x DO (isolation), power in source for DIO isolation, 14~48VDC, 1 x M12 K-coded 5-pin for power input, 1 x Connector 2-pin for ignition input, 4 x SMA connector holes for WWAN, 2 x RP-SMA connector holes for WLAN, 2 x Externally accessible dual nano-SIM card sockets with cover, 8 x SMA connector holes for WWAN, and 2 x RP-SMA connector holes for WLAN |
| PoE | - |
| Computer | |
| CPU | Intel® 12/13th Gen Core™ CPU (65W/35W), Chipset: Intel R680E, Graphics: Intel® UHD Graphics770,1.55GHz |
| Expansion | 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0), 2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 2, SATA 3.0) for LTE/5G NR module with 1 x external dual nano-SIMs, 1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0, PCIe 3.0), 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0), 2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 1) for LTE/5G NR module with 2 x external dual nano-SIMs |
| Storage | 2 x 2.5” SATA 3.0 external SSD (15mm height, removable), 1 x mSATA (occupied mini-PCIe slot), 2 x M.2 Key B (occupied M.2 socket), 1 x microSD card slot, SDXC v3.01 |
| Video Output | 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz, 1 x VGA, up to 1920 x 1200@60Hz |
| Compatible Operating Systems | |
| Operating System | Windows 11/Windows 10/Linux |
| Power Requirements | |
| Power Supply | Power input 24VDC/36VDC (14~48VDC) w/o isolation Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software Support S3/S4 suspend mode 10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code |
| General | |
| Memory | 2 x 262-pin SO-DIMM, DDR5 4800MHz 64GB in max., ECC & dual-channel support |
| Security | TPM 2.0: InfineonSLB9665TT2.0FW5.62 |
| GNSS | 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS /Glonass/Galileo/Beidou, 1 x 3D accelerometer and 3D gyroscope |
| Physical Characteristics | |
| Dimensions | 260 x 210 x 80 (W x D x H) (mm) |
| Operating temperature | EN 50155, class OT3 (-35°C ~70°C), 85°C for 10 minutes (w/35W TDP CPU, 60W PoE, 8GB memory, industrial SSD) with air flow |
| Storage Temperature | -40°C to 80°C |
| Relative humidity | 90% (non-condensing) |
| Shock Protection | Shock (SSD) Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g, Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g |
| Vibration Protection | Vibration (random) 2g@5~500 Hz (in operation, SSD), Vibration (SSD) Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure, Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test |
| Standards and Certifications | CE/UKCA/FCC Class A, EN 50155: 2017, Ambient temperature EN 50155, Class OT3 (-35°C ~70°C), 85°C for 10 minutes, Interruptions of voltage supply class S1, Supply change over class C1, EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019, Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30, Shock and vibration IEC 61373 Class B, Protective coating class PC1 (PC2, by request), EN 45545-2: 2020 (PCB) |
| Weight | 6.3kg (TBD) |
