Nexcom ICES 670 Computer-on-Module
- Intel® 4th generation Core™ processor
- Mobile Intel® QM87 chipset
- Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs
- Support Dual channel ECC-DDR3L/ SO-DIMMs 1333/1600MHz up to 16GB
- Support PCIe x16, 7x PCIe x 1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
- Up to 3x independent displays, VGA, eDP/ LVDS, DVI, HDMI, DisplayPort
- Dimension 95 x 125mm2 (W x L)
Description
The ICES 670 is a COM Express Type 6-pinouts Basic Module featuring Intel® Lynx-Point PCH chipset that supports Intel® 4th generation Intel® Core™ processors (Haswell/Shark Bay mobile) with Dual ECC-DDR3 SO-DIMM socket up to 16GB DDR3L 1333/1600MHz SDRAM. The ICES 670 integrated Intel® GT1/GT2/ GT3 graphics engines with DX11.1 support or expands via PCI express graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows a type 6-pinout Carrier board to implement HDMI, DVI, DisplayPort, eDP, and legacy VGA, single channel 18-/24-bit LVDS interface. The high-performance ICES 670 COM express Basic Module supports 4 x USB 3.0/8 x USB 2.0, 2 x SATA 3.0/ 2 x SATA 2.0, and 7 x PCIex1 lanes through our NEXCOM-designed ICES 8060 as well as customized solution for your embedded projects.
You can place an order for the Nexcom ICES 670 Computer-on-Module, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.
Specification
| General | |
|---|---|
| Form factor | - |
| Expansion | - |
| Graphic Interfaces | - |
| Super I/O | - |
| I/O Interface | - |
| Network | - |
| Audio | |
| EEPROM | - |
| Watchdog Timer | - |
| On-board RTC | - |
| CPU Support | Support Intel® BGA 1364, 4th generation Intel® Core™ processors (Haswell-M/Shark Bay-MB) |
| Chipset | - |
| Main Memory | Dual ECC-DDR3L/SO-DIMMs, support 1333/1600MHz memory up to 16GB |
| BIOS | AMI system UEFI BIOS, Plug and play support, Advanced power management and advanced configuration & power interface support |
| Display | Intel® GT1/GT2/GT3 integrated graphics processing unit (iGPU), One PCI express x16 (Gen. 3.0) lane down to the carried board, Supports VGA and eDP/LVDS interface, 3 x DDI (Digital Display Interface) supports HDMI/DVI, DP/eDP interfaces |
| On-board LAN | Intel® Clarkville (I217) Gigabit Ethernet, support next generation vPro/ iAMT, Support PXE boot from LAN, wake on LAN function, Signals down to I/O board |
| COM Express Connector | AB : VGA/LVDS/8 x USB 2.0/HD Audio/4 x SATA/GbE/GPIO/LPC bus, 1 x PCIe x4/2 x PCIe x1/SMBus (I2C)/SPI BIOS/SPK out, CD : PCIe x16/3 x DDI/4 x USB 3.0/1 x PCIex1 |
| Power Requirements | |
| Power Input | +12V, +5VSB, +3.3V RTC power |
| physical characteristics | |
| Dimensions | 95mm (W) x 125mm (L) |
| Operating temperatures | -15°C to 60°C |
| Storage temperature | -20°C to 80°C |
| Relative humidity | 10% to 90% (operating, non-condensing), 5% to 95% (non-operating, non-condensing) |
| Standards and Certifications | Meet CE, FCC Class A |
