Nexcom ICES 668 Computer-on-Module
- Embedded Intel® 3rd generation Core™ i7/ i5/ i3 processor, Ivy Bridge Mbl + ECC
- Intel® QM77 PCH chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
- Support Dual channel DDR3 with ECC SO-DIMMs 1333/1600MHz up to 16GB
- Support PCIe x16, 7x PCIe x1, 4x USB3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and GbE
- Up to 3x Independent Displays, VGA, Dual Channels 18/24-bit LVDS, DVI, HDMI, DisplayPort
- Dimension 95mm (W) x 125mm (L)
Description
The ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel® QM77 PCH chipset supports Intel® 3rd generation Intel® Core™ processor with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/1600MHz SDRAM with ECC support. The ICES 668 integrated Intel® HD graphics with DX11 support or expands via PCI Express Graphic 1 x 16 lanes and supports three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows a type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO, and legacy VGA, 18/24 bits LVDS interface.
The high-performance ICES 668 COM Express Basic Module supports 4 x USB3.0/8 x USB2.0, 2 x SATA 3.0/2 x SATA 2.0, and 7 x PCIex1 lanes through our NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ODM projects.
You can place an order for the Nexcom ICES 668 Computer-on-Module, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.
Specification
| General | |
|---|---|
| Form factor | - |
| Expansion | - |
| Graphic Interfaces | - |
| Super I/O | - |
| I/O Interface | - |
| Network | - |
| Audio | HD audio interface |
| EEPROM | - |
| Watchdog Timer | - |
| On-board RTC | - |
| CPU Support | Support Intel® BGA 1023, 3rd generation Intel® Core™ processor, Intel® Core™ i7 3615QE (4C/6M cache/2.3GHz/Max. TDP 45W), Intel® Core™ i7 3555LE (2C/4M cache/2.5GHz/Max. TDP 25W), Intel® Core™ i7 3517UE (2C/4M cache/1.7GHz/Max. TDP 17W), Intel® Core™ i3 3217UE (2C/3M cache/1.6GHz/Max. TDP 17W), Intel® Core™ i5 3610ME (2C/3M cache/2.7GHz/Max. TDP 35W) |
| Chipset | - |
| Main Memory | Dual DDR3/SO-DIMMs, support 1333/1600MHz ECC system memory up to 16GB |
| BIOS | AMI System UEFI BIOS, Plug and play support, Advanced power management and advanced configuration & power interface support |
| Display | Intel® HD graphics with DX11 support up to triple independent displays, One PCI Express x16 Lane down to the carried board, Supports VGA and single/dual channel s 18/24 bit LVDS interface, 3 x DDI (Digital Display Interface) supports HDMI/DVI, DisplayPort and SVDO interfaces |
| On-board LAN | Intel® 82579LM Gigabit Ethernet, support iAMT 8.0, Support PXE boot from LAN, wake on LAN function, Signals down to I/O board |
| COM Express Connector | AB : VGA/LVDS/8 x USB2.0/2 x Serial Port/HD Audio/4 x SATA/GbE/GPIO/ LPC bus, 1 x PCIex4/2 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out, CD : PCIex16/3 x DDI/4 x USB3.0/1 x PCIex1 |
| Power Requirements | |
| Power Input | +12V, +5VSB, +3.3V RTC power |
| physical characteristics | |
| Dimensions | 95mm (W) x 125mm (L) |
| Operating temperatures | 0°C to 60°C |
| Storage temperature | -20°C to 80°C |
| Relative humidity | 10% to 90% (operating, non-condensing), 5% to 95% (non-operating, non-condensing) |
| Standards and Certifications | Meet CE, FCC Class A |
