Nexcom ICES 667 Computer-on-Module
- 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
- Intel® QM77 PCH (HM76 ) chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
- Support two DDR3 SO-DIMMs 1333/ 1600 non-ECC up to 16GB
- Support PCIex16 (Gen3.0) 7x PCIEx1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
- Up to 3x DDI (DP/ HDMI/ DVI) multiple displays, VGA, dual channels 18/ 24-bit LVDS
- Dimension: 95mm (W) x 125mm (L)
Description
The ICES 667 is a Type 6 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset that supports 3rd generation Intel® Core™ i7/i5/i3 rPGA988 embedded processors up to i7-3610QE (4 x 2.3GHz/max.TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB.
The 3rd Generation Intel® Core™ i7/i5/i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen. 3.0) to the carrier board. The Three DDI interfaces allow ICES 667 to implement HDMI, DVI, Display Port, and SDVO on Customer Solution Board besides VGA, and LVDS interfaces. The high-performance ICES 667 COM Express Module supports 4 x SATA2.0/3.0, 12 x USB2.0/3.0, and 7 x PCIex1 lanes through the carrier board; NEXCOM is offering standard Type 6 carrier board, ICEB 8060 to help device makers and equipment builders to evaluate the full set of I/O function and add-on cards at the early development stage.
You can place an order for the Nexcom ICES 667 Computer-on-Module, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.
Specification
| General | |
|---|---|
| Form factor | - |
| Expansion | - |
| Graphic Interfaces | - |
| Super I/O | - |
| I/O Interface | - |
| Network | - |
| Audio | HD audio interface |
| EEPROM | - |
| Watchdog Timer | - |
| On-board RTC | - |
| CPU Support | Support 3rd generation Intel® Core™ i7/i5/i3 embedded rPGA988 processors : - Intel® Core™ i7-3610QE (4 x 2.3GHz/6MB cache/Max. TDP 45W), - Intel® Core™ i7-3610ME (2 x 2.7GHz/3MB cache/Max. TDP 35W), - Intel® Celeron® B810 (2 x 1.6GHz/2MB cache/Max. TDP 35W) |
| Chipset | - |
| Main Memory | Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB |
| BIOS | AMI UEFI System BIOS, Plug and play support, Advanced Power Management and ACPI support |
| Display | Intel® HD graphics with DX11 support and supports Triple independent displays displays, One PCI Express x16 Lane (Gen. 3.0) down to the carried board, Supports VGA, single/dual channels LVDS 18/24-bit interfaces, 3 x DDI supports HDMI, DVI, DisplayPort and SDVO (only by Port B/DDI #1) |
| On-board LAN | Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported with QM77 only), Support boot from LAN, wake on LAN function, Signals down to I/O board |
| COM Express Connector | AB : VGA/LVDS/8 x USB2.0, HD Audio/4 x SATA2.0/3.0, GbE/GPIO/LPC bus, 1 x PCIex4/2 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out, CD : PCIex16(Gen. 3.0)/3 x DDI/4 x USB3.0/PCIex1 |
| Power Requirements | |
| Power Input | +12V, +5VSB, +3.3V RTC power |
| physical characteristics | |
| Dimensions | 95mm (W) x 125mm (L) |
| Operating temperatures | -15°C to 60°C |
| Storage temperature | -20°C to 80°C |
| Relative humidity | 10% to 90% (operating, non-condensing), 5% to 95% (non-operating, non-condensing) |
| Standards and Certifications | Meet CE, FCC Class A |
