Nexcom XPPC 16-200 Panel PC
- 15.6” TFT FHD 16:9 panel
- 10 Points P-Cap multi-touch with a slim bezel design
- IP65 protection on the front
- Support: VESA/Panel/Openframe Mount
- 11th Generation Intel® Tiger Lake-UP3 Core™ processor SoC
- 1 x 260-pin DDR4 SO-DIMM up to 32G
- Onboard M.2 2280 Key M with PCIe x4 signal for storage module
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Support power input 12 VDC
Description
The 15.6“ fanless touch computer XPPC 16-200 incorporating an industrial motherboard is intended for versatile industrial applications. XPPC 16-200 has a touchscreen LED backlight LCD panel with 1920 x 1080 (FHD) resolution and 450-nit brightness. The front panel which adopts a flush design and complies with IP65 standard by panel mount makes it the perfect fit for industrial applications. XPPC 16-200 powered by Intel® Tiger Lake-UP3 Core™ SoC. XPPC 16-200 has a slim design and weight optimization. XPPC 16-200 support multi-mounting choices based on different applications. XPPC 16-200 can be applied in different situations. Examples: hotel self-check-in system, department store, welcome aboard, and advertisements.
You can place an order for the Nexcom XPPC 16-200 Panel PC, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.
Specification
| General | |
|---|---|
| Panel | LCD size: Innolux G-series 15.6”, 16:9 Resolution: Full HD 1920 x 1080 Luminance - LCD panel: 450cd/m2 - XPPC PCAP touch: 405cd/m2 Contrast ratio: 700 LCD color: 16.7M Viewing angle: 89 (U), 89 (D), 89 (L), 89 (R) |
| Mechanical | Color/material: black silver/metal sheet Support - VESA mount 100mm x 100mm - Panel mount - Open frame |
| Touch screen | 10 Points P-Cap (projected capacitive touch) Optical bonding Glass surface treatment: AS (Anti-Smudge Coating for easy cleaning) |
| System | XPPC 16-200-i3 - Onboard 11th Generation Intel® Core™ i3-1115G4E processor, Dual-Core, 2.2 GHz base frequency, 6M Cache (formerly Tiger Lake-UP3) - Intel® UHD Graphics 630 on i3 processor XPPC 16-200-i5 (by request) - Onboard 11th Generation Intel® Core™ i5-1145G7E processor, Dual-Core, 1.5 GHz base frequency, 8M Cache - Intel® Iris® Xe Graphics on i5 processor |
| Interface | |
| Rear I/O | 1 x RS232/422/485 1 x 12V DC Jack 2 x RJ45 Intel® Gigabit LAN port 1 x DP++ 1 x HDMI 2.0 4 x USB 3.0 1 x Line-out LED for power on/off Power switch |
| Front I/O | 2 x Antenna hole |
| Power requirements | |
| Power supply voltage | 1 x External 96W AC/DC power adapter with lock (power adapter is included in accessory) Input: 100VAC to 240VAC Output: DC+12VDC |
| Physical Characteristics | |
| Vibration | IEC 68 2-64 - 2Grms @ sine, 5~500Hz, 1hr/axis - 2.2Grms @ random condition, 5~500Hz, 0.5hr/axis (non-operating) |
| Shock Protection | IEC 68 2-27 - 50g peak acceleration (11 msec. duration) |
| Operating temperature | 0°C~50°C |
| Storage Temperature | -20°C~60°C |
| Humidity | 10%~90% relative humidity, non-condensing limits to be at 90% |
| Dimensions | System: 382.2mm x 251.4mm x 51.7mm Package: 476mm x 355mm x 206mm |
| Weight | System weight: 3.0kg Package weight: 4.7kg |
| Standards and Certifications | CE (EN55035 + EN55032) FCC Class A (EMI Part 15B) LVD (EN62368-1) |
| Compatible Operating Systems | |
| OS Support List | Win10 64-bit Linux |
| General | |
| Main Memory | 1 x 260-pin DDR4 SO-DIMM, supports non-ECC, un-buffered memory up to 32G |
| Storage Device | 1 x M.2 2280 Key M SSD, support PCIe x4 |
| Expansion Slot | 1 x M.2 2230 Key E, support optional Wi-Fi modules |
