Nexcom X103-x6413E Embedded Board
- Intel Atom® x6413E processor
- 1 x DDR4 SO-DIMM socket, up to 32GB
- Support 1 x HDMI 1.4, 4K30Hz, and a dual channel 18/24-bits LVDS connector, up to 1920 x 1080@60Hz
- TPM2.0 on board
- Rich I/O connectivity: 3 x 2.5GbE LAN, 4 x USB port, 6 x COM
- Variety expansion: 1 x M.2 Key B, 1 x M.2 Key E, 1 x mini-PCIe slot
- Support dual power input, 12V/24V
Description
X103 is a 3.5” single-board computer designed with multi-core Intel Atom® x6000E Series SoC processors. X103 series targets embedded applications with its advanced computing performance, low power consumption, and integrated with rich I/O features. It supports 1 x HDMI 1.4, 1 x LVDS (2K), triple 2.5GbE LAN ports, 2 x USB 3.2 Gen2 ports, 2 x USB 2.0 ports, 2 x RS232/RS422/RS485 and 4 x RS232 ports. Meanwhile, it supports various M.2 and mini-PCIe slot expansions, compatible with various modules for multiple industry applications, for example: smart parking, EV charging stations, vending machines, kiosks, etc. X103 series supports wide-range operating temperatures from -40°C to 85°C. It is the best choice and ideal design for semi-outdoor and outdoor embedded applications.
You can place an order for the Nexcom X103-x6413E Embedded Board, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.
Specification
General | |
---|---|
CPU Support | Intel Atom® x6000E Series SoC processors: x6413E, qual-core, 1.5GHz, 9W (default) |
Display | Intel® Gen11 UHD graphics engines, 1 x HDMI 1.4, resolution up to 3840 x 2160@30Hz, 1 x Dual channel 18/24-bit LVDS connector, up to 1920x 1080@60Hz (optional: eDP selects by jumper setting) |
Main Memory | 1 x 260-pin DDR4 SO-DIMM socket, support 3200MHz, up to 32GB, with non-ECC, Un-buffered memory, Un-buffered memory |
Expansion | 1 x M.2 Key B, support 3052 (Signal SATA, USB2.0, USB3.0), 1 x M.2 2230 Key E for Wi-Fi+BT module, 1 x mini-PCIe slot (PCIe, USB 2.0, SATA signal), 1 x SIM socket onboard, support Key B+M, 5G/LTE module |
I/O Interface | Edge I/O Interface: 3 x RJ45 connector with LEDs, 1 x HDMI 1.4 output, 2 x USB 3.2 Gen2, 2 x USB 2.0, 1 x Speaker out (6W) / Onboard Internal I/O: COM1~2: RS232/422/485, 9-pin header, COM3~6: RS232 only, 9-pin header, 1x, 10-pin header for GPIO, 4x GPI, 4x GPO, 1x 4-pin Smart Fan connector, 2, 2x 5-pin header for 2x USB 2.0 ports, 1x 9-pin header for MIC-in/Line-out |
Operating System | Win10 64-bit, Linux 4.1 above |
Power Requirements | |
Power | Support 12V/24V DC power Input via 1 x 4-pin ATX connector |
Physical Characteristics | |
Operating temperature | -40°C ~ 85°C in chamber with airflow 0.7m/s |
Storage temperature | -40°C to 85°C |
Relative humidity | 95% (non-condensing) |
Dimensions | 146mm (L) x 102mm (W) (5.7” x 4.0”) |
Standards and Certifications | CE (EN55035 + EN55032), FCC Class A (EMI part 15B) |