Easy World Automation | Nexcom ICES 268 Computer-on-Module

Nexcom ICES 268 Computer-on-Module

  • Intel® 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
  • Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 2, pin-outs
  • Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB
  • Support PCIex16 (Gen3.0), 5x PCIex1, 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 1x GbE
  • Support VGA, dual channels 18/24-bit LVDS and optional 1x DDI/ SDVO by PEG
  • Dimension: 95mm (mm) x 125mm (L)

Description

The ICES 268 is a Type 2 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset that supports Intel® 3rd generation Intel® Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4 x 2.3GHz/max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB. The 3rd Generation Core i7/i5/i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen 3.0) to the carrier board. The optional 1 x DDI interfaces port B, allows ICES 268 to implement SDVO to HDMI, DVI, and DP ports by add-in EBK-A2HDMI. The high-performance ICES 268 COM Express Basic Module supports 4 x SATA3.0/2.0, 8 x USB2.0, 5 x PCIex1 lanes, and 1 x Gigabit Ethernet through the carrier board; NEXCOM is offering standard Type 2 carrier board, ICEB 8050C as well as hardware-ready evaluation starter-kit, ICEK 8050C-T2 build-in 10.4” LCD panel, Flex-ATX power supply to help device makers and equipment builders may evaluate the full set of I/O function and add-in cards at the early development stage.


You can place an order for the Nexcom ICES 268 Computer-on-Module, which is applicable in the Factory Automation industry, online via one of our Middle East branches (Dubai/ Oman/Saudi Arabia) and get it delivered at a low cost at a specific time.

Specification

General
Form factor -
Expansion -
Graphic Interfaces -
Super I/O -
I/O Interface -
Network -
Audio HD audio interface
EEPROM -
Watchdog Timer -
On-board RTC -
CPU Support Support Intel® 3rd generation Core™ i7/i5/i3 embedded rPGA988 processors, Intel® Core™ i7-3610QE (4 x 2.3GHz/6MB cache/Max. TDP 45W), Intel® Core™ i7-3610ME (2 x 2.7GHz/3MB cache/Max. TDP 35W), Intel® Celeron® B810 (2 x 1.6GHz/2MB cache/Max. TDP 35W)
Chipset -
Main Memory Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB
BIOS AMI UEFI System BIOS, Plug and play support, Advanced Power Management and ACPI support
Display Intel® HD graphics with DX11 support and supports Triple independent displays, One PCI Express x16 Lane (Gen 3.0) down to the carried board, Supports VGA, single/dual channels LVDS 18/24-bit interfaces, Optional 1 x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG with EBK-A2HDMI
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77 only), Support boot from LAN, wake on LAN function, Signals down to I/O board
COM Express Connector AB : VGA/LVDS/8 x USB2.0, HD Audio/2 x SATA3.0, 2 x SATA 2.0/GbE/GPIO/ LPC bus/5 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out, CD : PCIex16 (Gen. 3.0)/PCI (v2.3)/IDE
Power Requirements
Power Input +12V, +5VSB, +3.3V RTC power
physical characteristics
Dimensions 95mm (W) x 125mm (L)
Operating temperatures -15°C to 60°C
Storage temperature -20°C to 80°C
Relative humidity 10% to 90% (operating, non-condensing), - 5% to 95% (non-operating, non-condensing)
Standards and Certifications Meet CE, FCC Class A